Posted on 19/06/2024 by sciencefatherLeave a Comment on Yifan YAO | Materials for 5G and Beyond | Best Researcher Award 57 / 100 Powered by Rank Math SEO Mr. Yifan YAO | Materials for 5G and Beyond | Best Researcher Award PhD student at City University of Hong Kong, Hong Kong. Yifan YAO is a dedicated scholar pursuing a Doctor of Philosophy in Materials Science and Engineering at City University of Hong Kong. They completed their Bachelor of Engineering in Materials Engineering at Beihang University, where they achieved notable academic success with a GPA of 3.46. Yifan’s research focuses on innovative materials applications, evident in their publications in renowned journals such as Advanced Functional Materials and Scripta Materialia. They gained practical experience as a Process Engineer at Shenyang Aircraft Corporation, broadening their expertise in materials processing and reliability testing. Yifan has been recognized for their academic achievements, including awards like the FLTRP-ETIC Cup English Writing Contest Preliminary Second Prize and the Novel Aviation Materials Scholarship. With a strong foundation in materials engineering and a passion for research, Yifan is poised to make significant contributions to the field. Professional Profiles: Scopus Profile ORCID Profile Education Yifan YAO pursued his Bachelor of Engineering in Materials Engineering at Beihang University in Beijing, China, from September 2018 to June 2022. During this period, he achieved a commendable GPA of 3.46 out of 4.00, with an overall grade of 86.07 out of 100. Yifan also demonstrated strong English proficiency with an IELTS score of 6.5 and academic excellence reflected in his GRE scores: 152 in Verbal, 168 in Quantitative, and 3.5 in Analytical Writing. He successfully passed the National College Entrance Examination with a notable score of 675 out of 750. Currently, Yifan YAO is pursuing a Doctor of Philosophy in Materials Science and Engineering at City University of Hong Kong, with expected completion by August 2026. His academic journey is marked by a GPA of 3.63 out of 4.00, showcasing his dedication to furthering his expertise in the field of materials science and engineering. Research Interest Yifan YAO is pursuing a Doctor of Philosophy in Materials Science and Engineering at City University of Hong Kong, building upon a solid foundation laid during their Bachelor of Engineering in Materials Engineering at Beihang University, where they graduated with a GPA of 3.46 out of 4.00. Their research interests encompass diverse aspects of materials science, focusing on areas such as advanced functional materials, electromigration in microelectronics, and the mechanical behavior of materials. Yifan has already contributed significantly to the field with publications in reputable journals like Advanced Functional Materials and Scripta Materialia, exploring topics ranging from nanocomposites for battery separators to reliability issues in 3D integrated circuit technologies. Their internship at Shenyang Aircraft Corporation further enriched their expertise in materials processing and aerospace applications, underscoring their commitment to advancing knowledge in the field of materials science through rigorous academic pursuit and practical experience. Award and Honors Yifan YAO has garnered significant recognition and accolades for their academic achievements and contributions to materials science and engineering. They received the FLTRP-ETIC Cup English Writing Contest Preliminary Second Prize, showcasing their proficiency in English writing. Additionally, Yifan was honored as the Annual Merit Student of Beihang University, underscoring their consistent academic excellence and contribution to the university community. Further highlighting their dedication to research, Yifan also received the Novel Aviation Materials Scholarship at Beihang University, emphasizing their commitment to advancing materials science, particularly in the field of aviation. These awards not only reflect Yifan’s scholarly capabilities but also recognize their potential in making substantial contributions to the field of materials engineering. Publications Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology Authors: Yao, Y.; Gusak, A.M.; Chen, C.; Liu, Y.; Tu, K.N. Journal: Scripta Materialia Year: 2024 Volume: 250 Pages: 116175 Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology Authors: Yao, Y.; An, Y.; Tu, K.N.; Liu, Y. Journal: Journal of Materials Research and Technology Year: 2024 Volume: 28 Pages: 3573-3582 Electromigration in three-dimensional integrated circuits Authors: Shen, Z.; Jing, S.; Heng, Y.; Tu, K.N.; Liu, Y. Journal: Applied Physics Reviews Year: 2023 Volume: 10(2) Pages: 021309 Citations: 12 Coupling Effect of Electromigration and Joule Heating Induced Failure in Advanced Packaging Authors: Yao, Y.; An, Y.; Tu, K.-N.; Liu, Y. Conference: 24th International Conference on Electronic Packaging Technology, ICEPT 2023 Year: 2023 Failure of Ball Grid Array during Electromigration and the Simulation of Dynamic Void Formation Authors: Yao, Y.; An, Y.; Tu, K.-N.; Liu, Y. Conference: Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023 Year: 2023 Pages: 316–319 Yifan YAO | Materials for 5G and Beyond | Best Researcher Award