Posted on 15/06/2024 by sciencefatherLeave a Comment on King-Ning TU | Advanced Materials Engineering | Excellence in Research 56 / 100 Powered by Rank Math SEO Prof Dr. King-Ning TU | Advanced Materials Engineering | Excellence in Research Chair Professor at City University of Hong Kong, Hong Kong. Prof. Dr. King-Ning Tu is a distinguished academic and researcher in materials science and engineering. He completed his education with a B.Sc. in Mechanical Engineering from National Taiwan University, an M.Sc. in Materials Science from Brown University, and a Ph.D. in Applied Physics from Harvard University. Throughout his illustrious career, Dr. Tu has held notable positions such as Professor and Chair of the Department of Materials Science and Engineering at UCLA, TSMC Chair Professor at National Chiao Tung University, and Chair Professor at City University of Hong Kong. His research focuses on electronic thin films, solder joint technology, and nanoscale materials, with significant contributions to these fields. Dr. Tu is recognized as a Fellow of prestigious societies like the American Physical Society and the Materials Research Society. He has authored several influential textbooks and received numerous awards for his outstanding contributions to materials science and engineering. Professional Profiles: Scopus Profile Education Prof. Dr. King-Ning Tu obtained his foundational education in Mechanical Engineering with a B.Sc. degree from National Taiwan University in Taiwan, which he completed in 1960. He then pursued further studies in the United States, earning an M.Sc. in Materials Science from Brown University in Providence, RI, in 1964. Continuing his academic journey, he completed his Ph.D. in Applied Physics at Harvard University in Cambridge, MA, in 1968. These educational milestones equipped him with a comprehensive understanding of mechanical engineering, materials science, and applied physics, forming the bedrock of his illustrious career in research and academia. Professional Experience Prof. Dr. King-Ning Tu has had a distinguished career spanning several prestigious institutions and roles in the field of materials science and engineering. He began as a Research Staff Member at IBM T. J. Watson Research Center, where he later became the 3rd Level Manager of the Materials Science Department. Over the years, he held significant academic positions, including Adjunct Professor at Cornell University and Professor and Chair at UCLA’s Department of Materials Science and Engineering. His contributions extended internationally, serving as the TSMC Chair Professor at National Chiao Tung University in Taiwan and as a Chair Professor at City University of Hong Kong. Tu’s research interests have focused on metal-silicon reactions, nanowires, and electronic packaging technology. He has authored several influential textbooks and received numerous honors, including fellowship in prestigious societies and awards for his research contributions to materials science and engineering. Research Interest Prof. Dr. King-Ning Tu is a distinguished figure in the field of materials science and engineering, celebrated for his extensive contributions spanning several decades. He began his illustrious career as a research staff member at IBM T. J. Watson Research Center, where he later rose to the position of 3rd Level Manager of the Materials Science Department. His tenure at IBM was marked by pioneering research in areas such as metal-silicon reactions, solder joint technology, and electromigration in nanowires. Over the years, Prof. Tu held significant academic appointments, including as Professor and Chair of the Department of Materials Science and Engineering at UCLA, and as a Distinguished Professor of Electrical Engineering. He also served as the TSMC Chair Professor at National Chiao Tung University and as a Chair Professor at City University of Hong Kong. Throughout his career, he has authored numerous influential textbooks and research papers that have advanced our understanding of electronic materials and their reliability in various applications. Prof. Tu’s work continues to inspire and guide researchers in the field worldwide. Award and Honors Prof. Dr. King-Ning Tu has garnered a wealth of accolades throughout his illustrious career in materials science and engineering. His contributions have been widely recognized by prestigious institutions and organizations worldwide. He was elected as a Fellow of the American Physical Society in 1981 and The Metallurgical Society in 1988. Serving as President of the Materials Research Society in 1981 and later being named a Fellow in 2010 further exemplifies his leadership in the field. Prof. Tu was honored with the Humboldt Research Award for Senior US Scientists in 1996 and appointed as a Royal Society/Kan Tong Po Visiting Professor at City University of Hong Kong in 2002. His election as an Academician of Academia Sinica, Taiwan, in 2002, and receipt of the TMS Electronic, Magnetic, and Photonic Materials Division Distinguished Scientist Award in 2007 highlight his profound impact on the discipline. More recently, he received the IEEE Components, Packaging, and Manufacturing Technology Award in 2017, underscoring his ongoing influence and contributions to the field. Research Skills Prof. Dr. King-Ning Tu is renowned for his extensive research contributions in materials science and engineering, spanning over several decades. His career began as a research staff member at IBM T. J. Watson Research Center, where he later served as the 3rd Level Manager of the Materials Science Department. Throughout his academic journey, Prof. Tu held significant positions including Adjunct Professor at Cornell University, Professor and Chair at UCLA’s Department of Materials Science and Engineering, and Distinguished Professor at UCLA’s Department of Electrical Engineering. His international engagements include roles as the TSMC Chair Professor at National Chiao Tung University in Taiwan, E-Sun scholar, and Chair Professor at City University of Hong Kong. Prof. Tu’s research focuses on diverse areas such as metal-silicon reactions, solder joint technology, and nanoscale materials’ kinetics and reliability. His leadership, mentorship, and prolific publication record have profoundly influenced the field, making him a pivotal figure in advancing materials science globally. Publications Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology Authors: Yao, Y.; Gusak, A.M.; Chen, C.; Liu, Y.; Tu, K.N. Journal: Scripta Materialia Year: 2024 Citations: 0 Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps Authors: Mao, X.; An, Y.; Chen, Y.; Tu, K.-N.; Liu, Y. Journal: Journal of Materials Research and Technology Year: 2024 Citations: 0 Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders Authors: Qiao, J.; Mao, X.; Tu, K.-N.; Liu, Y. Conference: 2024 International Conference on Electronics Packaging, ICEP 2024 Year: 2024 Citations: 0 Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology Authors: Yao, Y.; An, Y.; Tu, K.N.; Liu, Y. Journal: Journal of Materials Research and Technology Year: 2024 Citations: 0 Elements of Electromigration: Electromigration in 3D IC Technology Authors: Tu, K.-N.; Liu, Y. Book: Elements of Electromigration: Electromigration in 3D IC Technology Year: 2024 Citations: 0 Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints Authors: Hsu, W.-Y.; Yang, S.-C.; Lin, Y.-Y.; Chiang, C.-Y.; Chen, C. Journal: Nanomaterials Year: 2023 Citations: 1 Electromigration in three-dimensional integrated circuits Authors: Shen, Z.; Jing, S.; Heng, Y.; Tu, K.N.; Liu, Y. Journal: Applied Physics Reviews Year: 2023 Citations: 12 To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints Authors: Huang, Y.-R.; Tran, D.-P.; Hsu, P.-N.; Tu, K.N.; Chen, C. Journal: Journal of Materials Research and Technology Year: 2023 Citations: 6 Comparison between bulk and particle solder alloy on the performance of low-melting solder joints Authors: Yang, M.; Zhao, X.; Huo, Y.; Tu, K.-N.; Liu, Y. Journal: Journal of Materials Research and Technology Year: 2023 Citations: 2 Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder Authors: Shen, Z.; An, Y.; Xiong, Z.; Tu, K.-N.; Liu, Y. Conference: 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023 Year: 2023 Citations: 0 King-Ning TU | Advanced Materials Engineering | Excellence in Research