Vilas Gaikwad | Computer Science | Best Researcher Award Posted on 18/06/202418/06/2024 by sciencefatherLeave a Comment on Vilas Gaikwad | Computer Science | Best Researcher Award Dr. Vilas Gaikwad | Computer Science | Best Researcher Award Head of department at Trinity College of Engineering and Research Pune, India. Dr. Vilas Shivaji Gaikwad is a distinguished academic and researcher with a robust background in Computer Science and Engineering. He earned his PhD from Dr. Babasaheb Ambedkar Marathwada University (Dr. BAMU), specializing in image processing, data mining, embedded systems, and IoT. With over a decade of experience in academia, Dr. Gaikwad currently serves as an Assistant Professor and PG Coordinator at JSPM Narhe Technical Campus in Pune. His professional journey includes roles at Sanjeevan Engineering and Technology Institute and Walchand College of Engineering, where he contributed significantly to research and education. Dr. Gaikwad’s research focuses on histopathological image analysis for breast lesion classification, supported by projects funded by various institutions. He has published extensively, including 47 papers in international journals and multiple books on embedded systems and IoT. His work has earned him numerous awards, including appreciation for his teaching excellence and certifications from IBM and Cambridge. Dr. Gaikwad’s contributions to the academic and research communities highlight his dedication to advancing technology and education. Professional Profiles: Google Scholar Profile Scopus Profile ORCID Profile Education Dr. Vilas Shivaji Gaikwad holds a Ph.D. in Computer Science & Engineering from Dr. BAM University, Aurangabad, completed in May 2021. His dissertation focused on developing a novel approach for classifying intraductal breast lesions using histopathological image analysis. He earned his M.Tech in Computer Science & Engineering from Walchand College of Engineering, Sangli, under Shivaji University in August 2012, where he graduated with first-class honors. Additionally, he completed his B.E. in Computer Science & Engineering at TPCT COE, Osmanabad, affiliated with Dr. BAM University, in August 2010, achieving distinction in his studies. Professional Experience Dr. Vilas Shivaji Gaikwad has accumulated extensive professional experience over his career. Since June 2014, he has served as an Assistant Professor and PG Coordinator of Computer Engineering at JSPM Narhe Technical Campus in Pune, where he has contributed for nearly seven years. Prior to this, he worked as an Assistant Professor at Sanjeevan Engineering and Technology Institute, Panhala, Kolhapur, from July 2012 to June 2014, and as a Research Assistant at Walchand College of Engineering, Sangli, from August 2010 to July 2012. His academic contributions are further enriched by his recognition as a PG teacher from Savitribai Phule Pune University and permanent UG approval. Overall, Dr. Gaikwad has more than ten years of experience in the field of Computer Science & Engineering. Research Interest Dr. Vilas Shivaji Gaikwad’s research interests encompass a diverse array of cutting-edge topics within the field of Computer Science and Engineering. He is particularly focused on Image Processing, exploring techniques to enhance and interpret visual data through computational means. His work in Data Mining delves into extracting valuable insights from vast datasets, contributing to advancements in predictive analytics and decision-making processes. Additionally, Dr. Gaikwad is deeply involved in Embedded Systems and the Internet of Things (IoT), investigating innovative solutions for integrating hardware and software to create intelligent, interconnected devices. His Ph.D. research, titled “A Novel Approach of Classification for Intraductal Breast Lesions using Histopathological Image Analysis,” underscores his commitment to applying computational techniques to critical real-world problems, highlighting the interdisciplinary nature of his work and its potential impact on healthcare. Award and Honors Dr. Vilas Shivaji Gaikwad has received numerous awards and honors throughout his academic and professional career. He qualified for the GATE 2010 exam, showcasing his strong foundation in engineering principles. He is IBM RFT Certified and holds a Cambridge Certification as a Linux Associate, affirming his technical expertise. Dr. Gaikwad has been recognized multiple times for his excellence in teaching, earning accolades such as “Best Teacher” and receiving appreciation for achieving 100% results in his courses. His scholarly contributions have garnered significant attention, with his publications amassing over 19,000 reads on ResearchGate, a testament to his influence and impact in the research community. These recognitions underscore Dr. Gaikwad’s dedication to advancing knowledge, fostering academic excellence, and his significant contributions to the field of Computer Science and Engineering. Research Skills Dr. Vilas Shivaji Gaikwad possesses a robust set of research skills, developed through extensive academic and professional experiences. His expertise spans Image Processing, Data Mining, Embedded Systems, and IoT, enabling him to design advanced systems integrating hardware and software. His proficiency in Histopathological Image Analysis is evidenced by his Ph.D. research on classifying intraductal breast lesions, crucial for improving diagnostic tools and medical imaging techniques. Dr. Gaikwad’s work in wireless sensor networks demonstrates his capability in real-time data analysis and system design, particularly in predictive systems for natural disaster management. His skills in Research Project Management and Grant Writing are proven by his successful project funding and consultancy work. These abilities highlight his competence in leading innovative research initiatives and securing necessary resources, making significant contributions to the fields of computer science and engineering. Publications Title: Characterization of behavioral and endocrine effects of LSD on zebrafish Authors: L. Grossman, E. Utterback, A. Stewart, S. Gaikwad, K.M. Chung, C. Suciu, … Journal: Behavioural Brain Research Year: 2010 Citations: 291 Title: Steganography techniques: A review Authors: M.P.R. Kamble, M.P.S. Waghamode, M.V.S. Gaikwad, M.G.B. Hogade Journal: International Journal of Engineering Year: 2013 Citations: 18 Title: Human Monkeypox 2022 virus: Machine learning prediction model, outbreak forecasting, visualization with time-series exploratory data analysis Authors: Y.H. Bhosale, S.R. Zanwar, A.T. Jadhav, Z. Ahmed, V.S. Gaikwad, K.S. Gandle Conference: 2022 13th International Conference on Computing Communication and Networking Year: 2022 Citations: 12 Title: Molecular imaging to the surgeons rescue: Gallium-68 DOTA-exendin-4 positron emission tomography-computed tomography in pre-operative localization of insulinomas Authors: U.N. Pallavi, V. Malasani, I. Sen, P. Thakral, S. Dureja, V. Pant, V.S. Gaikwad, … Journal: Indian Journal of Nuclear Medicine Year: 2019 Citations: 10 Title: Enhanced whale optimization algorithm for the eye movement recognition Authors: V.S. Gaikwad Journal: Journal of Computational Mechanics, Power Systems and Control Year: 2021 Citations: 6 Title: One versus all classification in network intrusion detection using decision tree Authors: V. Gaikwad, P.J. Kulkarni Journal: International Journal of Scientific Research Publications Year: 2012 Citations: 6 Title: Novel approach for data stream clustering through micro-clusters shared Density Authors: P.V. Desai, V.S. Gaikawad Journal: International Journal of Computer Sciences and Engineering Year: 2019 (assumed for consolidation) Citations: 2 Title: Unveiling Market Dynamics through Machine Learning: Strategic Insights and Analysis Authors: V.S. Gaikwad, S.S. Deore, G.M. Poddar, R.V. Patil, D.S. Hirolikar, M.P. Borawake, … Journal: International Journal of Intelligent Systems and Applications in Engineering Year: 2024 Citations: 1 Title: Review of the state-of-the-art methods for privacy preserved classification in outsourced environment Authors: V.S. Gaikwad, K.H. Walse, V.M. Thakare Conference: 2020 International Conference on Innovative Trends in Information Technology Year: 2020 Citations: 1 Title: A Survey on Social Circle Influenced Personalized Recommendation System Authors: V.J. Kadam, V.S. Gaikwad Journal: International Journal of Science and Research Year: 2015 Citations: 1
King-Ning TU | Advanced Materials Engineering | Excellence in Research Posted on 15/06/2024 by sciencefatherLeave a Comment on King-Ning TU | Advanced Materials Engineering | Excellence in Research Prof Dr. King-Ning TU | Advanced Materials Engineering | Excellence in Research Chair Professor at City University of Hong Kong, Hong Kong. Prof. Dr. King-Ning Tu is a distinguished academic and researcher in materials science and engineering. He completed his education with a B.Sc. in Mechanical Engineering from National Taiwan University, an M.Sc. in Materials Science from Brown University, and a Ph.D. in Applied Physics from Harvard University. Throughout his illustrious career, Dr. Tu has held notable positions such as Professor and Chair of the Department of Materials Science and Engineering at UCLA, TSMC Chair Professor at National Chiao Tung University, and Chair Professor at City University of Hong Kong. His research focuses on electronic thin films, solder joint technology, and nanoscale materials, with significant contributions to these fields. Dr. Tu is recognized as a Fellow of prestigious societies like the American Physical Society and the Materials Research Society. He has authored several influential textbooks and received numerous awards for his outstanding contributions to materials science and engineering. Professional Profiles: Scopus Profile Education Prof. Dr. King-Ning Tu obtained his foundational education in Mechanical Engineering with a B.Sc. degree from National Taiwan University in Taiwan, which he completed in 1960. He then pursued further studies in the United States, earning an M.Sc. in Materials Science from Brown University in Providence, RI, in 1964. Continuing his academic journey, he completed his Ph.D. in Applied Physics at Harvard University in Cambridge, MA, in 1968. These educational milestones equipped him with a comprehensive understanding of mechanical engineering, materials science, and applied physics, forming the bedrock of his illustrious career in research and academia. Professional Experience Prof. Dr. King-Ning Tu has had a distinguished career spanning several prestigious institutions and roles in the field of materials science and engineering. He began as a Research Staff Member at IBM T. J. Watson Research Center, where he later became the 3rd Level Manager of the Materials Science Department. Over the years, he held significant academic positions, including Adjunct Professor at Cornell University and Professor and Chair at UCLA’s Department of Materials Science and Engineering. His contributions extended internationally, serving as the TSMC Chair Professor at National Chiao Tung University in Taiwan and as a Chair Professor at City University of Hong Kong. Tu’s research interests have focused on metal-silicon reactions, nanowires, and electronic packaging technology. He has authored several influential textbooks and received numerous honors, including fellowship in prestigious societies and awards for his research contributions to materials science and engineering. Research Interest Prof. Dr. King-Ning Tu is a distinguished figure in the field of materials science and engineering, celebrated for his extensive contributions spanning several decades. He began his illustrious career as a research staff member at IBM T. J. Watson Research Center, where he later rose to the position of 3rd Level Manager of the Materials Science Department. His tenure at IBM was marked by pioneering research in areas such as metal-silicon reactions, solder joint technology, and electromigration in nanowires. Over the years, Prof. Tu held significant academic appointments, including as Professor and Chair of the Department of Materials Science and Engineering at UCLA, and as a Distinguished Professor of Electrical Engineering. He also served as the TSMC Chair Professor at National Chiao Tung University and as a Chair Professor at City University of Hong Kong. Throughout his career, he has authored numerous influential textbooks and research papers that have advanced our understanding of electronic materials and their reliability in various applications. Prof. Tu’s work continues to inspire and guide researchers in the field worldwide. Award and Honors Prof. Dr. King-Ning Tu has garnered a wealth of accolades throughout his illustrious career in materials science and engineering. His contributions have been widely recognized by prestigious institutions and organizations worldwide. He was elected as a Fellow of the American Physical Society in 1981 and The Metallurgical Society in 1988. Serving as President of the Materials Research Society in 1981 and later being named a Fellow in 2010 further exemplifies his leadership in the field. Prof. Tu was honored with the Humboldt Research Award for Senior US Scientists in 1996 and appointed as a Royal Society/Kan Tong Po Visiting Professor at City University of Hong Kong in 2002. His election as an Academician of Academia Sinica, Taiwan, in 2002, and receipt of the TMS Electronic, Magnetic, and Photonic Materials Division Distinguished Scientist Award in 2007 highlight his profound impact on the discipline. More recently, he received the IEEE Components, Packaging, and Manufacturing Technology Award in 2017, underscoring his ongoing influence and contributions to the field. Research Skills Prof. Dr. King-Ning Tu is renowned for his extensive research contributions in materials science and engineering, spanning over several decades. His career began as a research staff member at IBM T. J. Watson Research Center, where he later served as the 3rd Level Manager of the Materials Science Department. Throughout his academic journey, Prof. Tu held significant positions including Adjunct Professor at Cornell University, Professor and Chair at UCLA’s Department of Materials Science and Engineering, and Distinguished Professor at UCLA’s Department of Electrical Engineering. His international engagements include roles as the TSMC Chair Professor at National Chiao Tung University in Taiwan, E-Sun scholar, and Chair Professor at City University of Hong Kong. Prof. Tu’s research focuses on diverse areas such as metal-silicon reactions, solder joint technology, and nanoscale materials’ kinetics and reliability. His leadership, mentorship, and prolific publication record have profoundly influenced the field, making him a pivotal figure in advancing materials science globally. Publications Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology Authors: Yao, Y.; Gusak, A.M.; Chen, C.; Liu, Y.; Tu, K.N. Journal: Scripta Materialia Year: 2024 Citations: 0 Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps Authors: Mao, X.; An, Y.; Chen, Y.; Tu, K.-N.; Liu, Y. Journal: Journal of Materials Research and Technology Year: 2024 Citations: 0 Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders Authors: Qiao, J.; Mao, X.; Tu, K.-N.; Liu, Y. Conference: 2024 International Conference on Electronics Packaging, ICEP 2024 Year: 2024 Citations: 0 Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology Authors: Yao, Y.; An, Y.; Tu, K.N.; Liu, Y. Journal: Journal of Materials Research and Technology Year: 2024 Citations: 0 Elements of Electromigration: Electromigration in 3D IC Technology Authors: Tu, K.-N.; Liu, Y. Book: Elements of Electromigration: Electromigration in 3D IC Technology Year: 2024 Citations: 0 Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints Authors: Hsu, W.-Y.; Yang, S.-C.; Lin, Y.-Y.; Chiang, C.-Y.; Chen, C. Journal: Nanomaterials Year: 2023 Citations: 1 Electromigration in three-dimensional integrated circuits Authors: Shen, Z.; Jing, S.; Heng, Y.; Tu, K.N.; Liu, Y. Journal: Applied Physics Reviews Year: 2023 Citations: 12 To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints Authors: Huang, Y.-R.; Tran, D.-P.; Hsu, P.-N.; Tu, K.N.; Chen, C. Journal: Journal of Materials Research and Technology Year: 2023 Citations: 6 Comparison between bulk and particle solder alloy on the performance of low-melting solder joints Authors: Yang, M.; Zhao, X.; Huo, Y.; Tu, K.-N.; Liu, Y. Journal: Journal of Materials Research and Technology Year: 2023 Citations: 2 Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder Authors: Shen, Z.; An, Y.; Xiong, Z.; Tu, K.-N.; Liu, Y. Conference: 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023 Year: 2023 Citations: 0