Lei Xia | Chemistry and Materials Science | Research Excellence Award

Assoc Prof Dr. Lei Xia | Chemistry and Materials Science | Research Excellence Award

University of Science & Technology Liaoning | China

Dr. Lei Xia is an accomplished materials scientist and associate professor at the University of Science & Technology Liaoning, specializing in materials processing, tribology, corrosion protection, and computational simulation. He holds a PhD in Applied Chemistry from the Research Institute of Petroleum Processing, a Master’s degree in Materials Forming and Control Engineering from the University of Science and Technology Beijing, and a Bachelor’s degree from Yanshan University. Since joining USTL as a lecturer in 2019 and becoming associate professor in 2024, Dr. Xia has developed a strong research portfolio integrating experimental, theoretical, and simulation-based approaches to improve metal processing technologies. His major research areas include tribology and lubrication mechanisms in rolling processes, microstructure–property relationships in metallic materials, corrosion behavior and protective coatings, and molecular-level insights into lubricant oxidation and surface interactions using MD and QM simulations. Dr. Xia has completed and contributed to multiple national and enterprise-supported research projects, focusing on the improvement of steel, aluminum, and copper alloy processing performance. His scholarly contributions exceed 40 publications in high-impact SCI and EI journals, such as Lubricants, Metals, Materials Research Express, Tribology Letters, Rare Metal Materials and Engineering, and China Petroleum Processing & Petrochemical Technology. Many of his works investigate fatigue properties, lubricant chemistry, tribological behaviors, corrosion mechanisms, and the influence of process parameters on material performance. He has published two patents and numerous articles as corresponding or first author, demonstrating his leadership in research innovation. Dr. Xia’s contributions extend to several industrial collaborations with major enterprises such as Anshan Iron and Steel Group, Baowu Group, and Sinopec, where his work has directly supported advancements in rolling technology and surface quality control. His recognition includes selection for the prestigious Liaoning “Baiqianwan Talent Program” and the “Steel Capital Talent Plan.” Alongside his research, he serves on the youth editorial boards of multiple journals including Journal of Iron and Steel Research, Rolling Steel, Special Steel, Mechanical Engineering Newsletter, and Journal of Materials and Metallurgy. He is also an active member of professional societies such as the Chinese Mechanical Engineering Society, Chinese Materials Research Society, Chinese Chemical Society, and the China Nonferrous Metals Industry Association. Through interdisciplinary expertise, impactful publications, industrial collaborations, and major talent awards, Dr. Xia has made significant contributions to tribology, corrosion protection, and advanced materials processing, strengthening both academic research and industrial innovation.

Profile: Google Scholar

Featured Publications

Xia, L., Ma, Z., Kokogiannakis, G., Wang, Z., & Wang, S. (2018). A model-based design optimization strategy for ground source heat pump systems with integrated photovoltaic thermal collectors. Applied Energy, 214, 178–190. https://doi.org/10.1016/j.apenergy.2018.02.024

Ma, Z., Xia, L., Gong, X., Kokogiannakis, G., Wang, S., & Zhou, X. (2020). Recent advances and development in optimal design and control of ground source heat pump systems. Renewable and Sustainable Energy Reviews, 131, 110001. https://doi.org/10.1016/j.rser.2020.110001

Duong, H. C., Xia, L., Ma, Z., Cooper, P., Ela, W., & Nghiem, L. D. (2017). Assessing the performance of solar thermal driven membrane distillation for seawater desalination by computer simulation. Journal of Membrane Science, 542, 133–142. https://doi.org/10.1016/j.memsci.2017.08.019

Xia, L., Ma, Z., Kokogiannakis, G., Wang, S., & Gong, X. (2018). A model-based optimal control strategy for ground source heat pump systems with integrated solar photovoltaic thermal collectors. Applied Energy, 228, 1399–1412. https://doi.org/10.1016/j.apenergy.2018.06.017

Chen, J., Xia, L., Li, B., & Mmereki, D. (2015). Simulation and experimental analysis of optimal buried depth of the vertical U-tube ground heat exchanger for a ground-coupled heat pump system. Renewable Energy, 73, 46–54. https://doi.org/10.1016/j.renene.2014.06.055

Qi, D., Pu, L., Ma, Z., Xia, L., & Li, Y. (2019). Effects of ground heat exchangers with different connection configurations on the heating performance of GSHP systems. Geothermics, 80, 20–30. https://doi.org/10.1016/j.geothermics.2019.01.006

Xia, L., Ma, Z., McLauchlan, C., & Wang, S. (2017). Experimental investigation and control optimization of a ground source heat pump system. Applied Thermal Engineering, 127, 70–80. https://doi.org/10.1016/j.applthermaleng.2017.07.111

Gong, X., Xia, L., Ma, Z., Chen, G., & Wei, L. (2018). Investigation on the optimal cooling tower input capacity of a cooling tower assisted ground source heat pump system. Energy and Buildings, 174, 239–253. https://doi.org/10.1016/j.enbuild.2018.06.021

King-Ning TU | Advanced Materials Engineering | Excellence in Research

Prof Dr. King-Ning TU | Advanced Materials Engineering | Excellence in Research

Chair Professor at City University of Hong Kong, Hong Kong.

Prof. Dr. King-Ning Tu is a distinguished academic and researcher in materials science and engineering. He completed his education with a B.Sc. in Mechanical Engineering from National Taiwan University, an M.Sc. in Materials Science from Brown University, and a Ph.D. in Applied Physics from Harvard University. Throughout his illustrious career, Dr. Tu has held notable positions such as Professor and Chair of the Department of Materials Science and Engineering at UCLA, TSMC Chair Professor at National Chiao Tung University, and Chair Professor at City University of Hong Kong. His research focuses on electronic thin films, solder joint technology, and nanoscale materials, with significant contributions to these fields. Dr. Tu is recognized as a Fellow of prestigious societies like the American Physical Society and the Materials Research Society. He has authored several influential textbooks and received numerous awards for his outstanding contributions to materials science and engineering.

Professional Profiles:

Education

Prof. Dr. King-Ning Tu obtained his foundational education in Mechanical Engineering with a B.Sc. degree from National Taiwan University in Taiwan, which he completed in 1960. He then pursued further studies in the United States, earning an M.Sc. in Materials Science from Brown University in Providence, RI, in 1964. Continuing his academic journey, he completed his Ph.D. in Applied Physics at Harvard University in Cambridge, MA, in 1968. These educational milestones equipped him with a comprehensive understanding of mechanical engineering, materials science, and applied physics, forming the bedrock of his illustrious career in research and academia.

Professional Experience

Prof. Dr. King-Ning Tu has had a distinguished career spanning several prestigious institutions and roles in the field of materials science and engineering. He began as a Research Staff Member at IBM T. J. Watson Research Center, where he later became the 3rd Level Manager of the Materials Science Department. Over the years, he held significant academic positions, including Adjunct Professor at Cornell University and Professor and Chair at UCLA’s Department of Materials Science and Engineering. His contributions extended internationally, serving as the TSMC Chair Professor at National Chiao Tung University in Taiwan and as a Chair Professor at City University of Hong Kong. Tu’s research interests have focused on metal-silicon reactions, nanowires, and electronic packaging technology. He has authored several influential textbooks and received numerous honors, including fellowship in prestigious societies and awards for his research contributions to materials science and engineering.

Research Interest

Prof. Dr. King-Ning Tu is a distinguished figure in the field of materials science and engineering, celebrated for his extensive contributions spanning several decades. He began his illustrious career as a research staff member at IBM T. J. Watson Research Center, where he later rose to the position of 3rd Level Manager of the Materials Science Department. His tenure at IBM was marked by pioneering research in areas such as metal-silicon reactions, solder joint technology, and electromigration in nanowires. Over the years, Prof. Tu held significant academic appointments, including as Professor and Chair of the Department of Materials Science and Engineering at UCLA, and as a Distinguished Professor of Electrical Engineering. He also served as the TSMC Chair Professor at National Chiao Tung University and as a Chair Professor at City University of Hong Kong. Throughout his career, he has authored numerous influential textbooks and research papers that have advanced our understanding of electronic materials and their reliability in various applications. Prof. Tu’s work continues to inspire and guide researchers in the field worldwide.

Award and Honors

Prof. Dr. King-Ning Tu has garnered a wealth of accolades throughout his illustrious career in materials science and engineering. His contributions have been widely recognized by prestigious institutions and organizations worldwide. He was elected as a Fellow of the American Physical Society in 1981 and The Metallurgical Society in 1988. Serving as President of the Materials Research Society in 1981 and later being named a Fellow in 2010 further exemplifies his leadership in the field. Prof. Tu was honored with the Humboldt Research Award for Senior US Scientists in 1996 and appointed as a Royal Society/Kan Tong Po Visiting Professor at City University of Hong Kong in 2002. His election as an Academician of Academia Sinica, Taiwan, in 2002, and receipt of the TMS Electronic, Magnetic, and Photonic Materials Division Distinguished Scientist Award in 2007 highlight his profound impact on the discipline. More recently, he received the IEEE Components, Packaging, and Manufacturing Technology Award in 2017, underscoring his ongoing influence and contributions to the field.

Research Skills

Prof. Dr. King-Ning Tu is renowned for his extensive research contributions in materials science and engineering, spanning over several decades. His career began as a research staff member at IBM T. J. Watson Research Center, where he later served as the 3rd Level Manager of the Materials Science Department. Throughout his academic journey, Prof. Tu held significant positions including Adjunct Professor at Cornell University, Professor and Chair at UCLA’s Department of Materials Science and Engineering, and Distinguished Professor at UCLA’s Department of Electrical Engineering. His international engagements include roles as the TSMC Chair Professor at National Chiao Tung University in Taiwan, E-Sun scholar, and Chair Professor at City University of Hong Kong. Prof. Tu’s research focuses on diverse areas such as metal-silicon reactions, solder joint technology, and nanoscale materials’ kinetics and reliability. His leadership, mentorship, and prolific publication record have profoundly influenced the field, making him a pivotal figure in advancing materials science globally.

Publications

  1. Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
    • Authors: Yao, Y.; Gusak, A.M.; Chen, C.; Liu, Y.; Tu, K.N.
    • Journal: Scripta Materialia
    • Year: 2024
    • Citations: 0
  2. Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps
    • Authors: Mao, X.; An, Y.; Chen, Y.; Tu, K.-N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2024
    • Citations: 0
  3. Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders
    • Authors: Qiao, J.; Mao, X.; Tu, K.-N.; Liu, Y.
    • Conference: 2024 International Conference on Electronics Packaging, ICEP 2024
    • Year: 2024
    • Citations: 0
  4. Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
    • Authors: Yao, Y.; An, Y.; Tu, K.N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2024
    • Citations: 0
  5. Elements of Electromigration: Electromigration in 3D IC Technology
    • Authors: Tu, K.-N.; Liu, Y.
    • Book: Elements of Electromigration: Electromigration in 3D IC Technology
    • Year: 2024
    • Citations: 0
  6. Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints
    • Authors: Hsu, W.-Y.; Yang, S.-C.; Lin, Y.-Y.; Chiang, C.-Y.; Chen, C.
    • Journal: Nanomaterials
    • Year: 2023
    • Citations: 1
  7. Electromigration in three-dimensional integrated circuits
    • Authors: Shen, Z.; Jing, S.; Heng, Y.; Tu, K.N.; Liu, Y.
    • Journal: Applied Physics Reviews
    • Year: 2023
    • Citations: 12
  8. To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
    • Authors: Huang, Y.-R.; Tran, D.-P.; Hsu, P.-N.; Tu, K.N.; Chen, C.
    • Journal: Journal of Materials Research and Technology
    • Year: 2023
    • Citations: 6
  9. Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
    • Authors: Yang, M.; Zhao, X.; Huo, Y.; Tu, K.-N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2023
    • Citations: 2
  10. Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder
    • Authors: Shen, Z.; An, Y.; Xiong, Z.; Tu, K.-N.; Liu, Y.
    • Conference: 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
    • Year: 2023
    • Citations: 0