Mahfuzur Rahman | Composite Materials | Excellence in Innovation

Published on by Research Awards

Mr. Mahfuzur Rahman | Composite Materials | Excellence in Innovation

Researcher at Bangladesh Army University of Science and Technology, Bangladesh.

Mahfuzur Rahman is an Industrial and Production Engineer with a Bachelor’s degree from Bangladesh Army University of Science and Technology. With a strong academic background, including a CGPA of 3.10, he has acquired extensive experience through industrial training at Maf Shoes Ltd. and visits to Central Locomotive Workshop and Saidpur Railway Workshop. His research interests lie in Lean Manufacturing, Production Planning and Control, Supply Chain Management, and Total Quality Management. Mahfuzur’s notable projects include investigating the static mechanical properties of Kenaf-Palmyra Palm Leaf Stalk Fiber Reinforced Composite and developing an ergonomic laptop stand. He has held leadership roles, such as Vice-President of the BAUST Cultural Society, and has attended seminars on global sourcing and the role of industrial engineers. Proficient in MS Office, SolidWorks, C, and C++, Mahfuzur is well-equipped to contribute to industrial engineering projects with his diverse skills and strong work ethic.

Professional Profiles:

Education 🎓

Mahfuzur Rahman completed his BSc in Industrial and Production Engineering from Bangladesh Army University of Science and Technology in 2023, achieving a CGPA of 3.10. Prior to this, he earned his Higher Secondary Certificate in Science from Sristy College of Tangail in 2017, with a GPA of 4.92. He also obtained his Secondary School Certificate in Science from Dighulia Shahid Mizanur Rahman High School in 2015, achieving a perfect GPA of 5.00.

Professional Experience

Mahfuzur Rahman gained valuable professional experience through his involvement in various industrial settings. In 2022, he completed industrial training at the Production and Industrial Engineering Department of Maf Shoes Ltd. in Chittagong, where he acquired hands-on knowledge in process optimization, time and motion studies, resource allocation, quality control, supply chain management, facility layout and design, lean manufacturing, six sigma, production planning, ergonomics, and project management. Additionally, he visited the Maintenance and Repair Department at the Central Locomotive Workshop in Parbotipur, Dinajpur, in 2021, and the Foundry Shop, Machine Shop, and Manufacturing Unit at Saidpur Railway Workshop in Saidpur, Nilphamari, in 2020, gaining insights into maintenance, repair, and manufacturing processes.

Research Interest

Mahfuzur Rahman’s research interests lie in the field of industrial and production engineering, focusing on process optimization, lean manufacturing, and quality control. He is particularly interested in exploring the static mechanical properties of composite materials, as demonstrated by his undergraduate thesis on Kenaf-Palmyra palm leaf stalk fiber reinforced composites. Additionally, Mahfuzur is passionate about product design and development, ergonomics, and the application of industrial engineering principles to enhance production efficiency and operational effectiveness. He seeks to contribute to advancements in manufacturing processes, supply chain management, and the integration of innovative solutions in industrial settings.

Award and Honors

Mahfuzur Rahman’s notable awards and honors include serving as Vice-President (Organizing) of the BAUST Cultural Society in 2023, showcasing his leadership and organizational skills. He also held the position of Assistance Organizing Secretary in 2022. His active participation in seminars, such as the ones on the “Role of Global Sourcing in Supply Chain Management” and the “Role of Industrial Engineers in Managing Operations,” highlights his commitment to continuous learning and professional development. Additionally, Mahfuzur took part in Mind Merge 2020, an event organized by the Department of Industrial and Production Engineering at BAUST, further demonstrating his engagement with the academic community and his dedication to advancing his field.

Research Skills

Mahfuzur Rahman possesses a diverse set of research skills essential for the field of Industrial and Production Engineering. His expertise includes Lean Manufacturing, Production Planning and Control, Supply Chain Management, and Total Quality Management. He is proficient in conducting Time and Motion Studies, Resource Allocation, and Process Optimization. His skills extend to Project Management, Facility Layout and Design, and Ergonomics, crucial for optimizing manufacturing processes. Additionally, Mahfuzur is adept in using tools like MS Office, Google Docs, and SolidWorks, along with programming languages C and C++. His research capabilities are further supported by his effective Communication Skills, Team Leadership, and Quality Control and Inspection techniques.

 

 

King-Ning TU | Advanced Materials Engineering | Excellence in Research

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Prof Dr. King-Ning TU | Advanced Materials Engineering | Excellence in Research

Chair Professor at City University of Hong Kong, Hong Kong.

Prof. Dr. King-Ning Tu is a distinguished academic and researcher in materials science and engineering. He completed his education with a B.Sc. in Mechanical Engineering from National Taiwan University, an M.Sc. in Materials Science from Brown University, and a Ph.D. in Applied Physics from Harvard University. Throughout his illustrious career, Dr. Tu has held notable positions such as Professor and Chair of the Department of Materials Science and Engineering at UCLA, TSMC Chair Professor at National Chiao Tung University, and Chair Professor at City University of Hong Kong. His research focuses on electronic thin films, solder joint technology, and nanoscale materials, with significant contributions to these fields. Dr. Tu is recognized as a Fellow of prestigious societies like the American Physical Society and the Materials Research Society. He has authored several influential textbooks and received numerous awards for his outstanding contributions to materials science and engineering.

Professional Profiles:

Education

Prof. Dr. King-Ning Tu obtained his foundational education in Mechanical Engineering with a B.Sc. degree from National Taiwan University in Taiwan, which he completed in 1960. He then pursued further studies in the United States, earning an M.Sc. in Materials Science from Brown University in Providence, RI, in 1964. Continuing his academic journey, he completed his Ph.D. in Applied Physics at Harvard University in Cambridge, MA, in 1968. These educational milestones equipped him with a comprehensive understanding of mechanical engineering, materials science, and applied physics, forming the bedrock of his illustrious career in research and academia.

Professional Experience

Prof. Dr. King-Ning Tu has had a distinguished career spanning several prestigious institutions and roles in the field of materials science and engineering. He began as a Research Staff Member at IBM T. J. Watson Research Center, where he later became the 3rd Level Manager of the Materials Science Department. Over the years, he held significant academic positions, including Adjunct Professor at Cornell University and Professor and Chair at UCLA’s Department of Materials Science and Engineering. His contributions extended internationally, serving as the TSMC Chair Professor at National Chiao Tung University in Taiwan and as a Chair Professor at City University of Hong Kong. Tu’s research interests have focused on metal-silicon reactions, nanowires, and electronic packaging technology. He has authored several influential textbooks and received numerous honors, including fellowship in prestigious societies and awards for his research contributions to materials science and engineering.

Research Interest

Prof. Dr. King-Ning Tu is a distinguished figure in the field of materials science and engineering, celebrated for his extensive contributions spanning several decades. He began his illustrious career as a research staff member at IBM T. J. Watson Research Center, where he later rose to the position of 3rd Level Manager of the Materials Science Department. His tenure at IBM was marked by pioneering research in areas such as metal-silicon reactions, solder joint technology, and electromigration in nanowires. Over the years, Prof. Tu held significant academic appointments, including as Professor and Chair of the Department of Materials Science and Engineering at UCLA, and as a Distinguished Professor of Electrical Engineering. He also served as the TSMC Chair Professor at National Chiao Tung University and as a Chair Professor at City University of Hong Kong. Throughout his career, he has authored numerous influential textbooks and research papers that have advanced our understanding of electronic materials and their reliability in various applications. Prof. Tu’s work continues to inspire and guide researchers in the field worldwide.

Award and Honors

Prof. Dr. King-Ning Tu has garnered a wealth of accolades throughout his illustrious career in materials science and engineering. His contributions have been widely recognized by prestigious institutions and organizations worldwide. He was elected as a Fellow of the American Physical Society in 1981 and The Metallurgical Society in 1988. Serving as President of the Materials Research Society in 1981 and later being named a Fellow in 2010 further exemplifies his leadership in the field. Prof. Tu was honored with the Humboldt Research Award for Senior US Scientists in 1996 and appointed as a Royal Society/Kan Tong Po Visiting Professor at City University of Hong Kong in 2002. His election as an Academician of Academia Sinica, Taiwan, in 2002, and receipt of the TMS Electronic, Magnetic, and Photonic Materials Division Distinguished Scientist Award in 2007 highlight his profound impact on the discipline. More recently, he received the IEEE Components, Packaging, and Manufacturing Technology Award in 2017, underscoring his ongoing influence and contributions to the field.

Research Skills

Prof. Dr. King-Ning Tu is renowned for his extensive research contributions in materials science and engineering, spanning over several decades. His career began as a research staff member at IBM T. J. Watson Research Center, where he later served as the 3rd Level Manager of the Materials Science Department. Throughout his academic journey, Prof. Tu held significant positions including Adjunct Professor at Cornell University, Professor and Chair at UCLA’s Department of Materials Science and Engineering, and Distinguished Professor at UCLA’s Department of Electrical Engineering. His international engagements include roles as the TSMC Chair Professor at National Chiao Tung University in Taiwan, E-Sun scholar, and Chair Professor at City University of Hong Kong. Prof. Tu’s research focuses on diverse areas such as metal-silicon reactions, solder joint technology, and nanoscale materials’ kinetics and reliability. His leadership, mentorship, and prolific publication record have profoundly influenced the field, making him a pivotal figure in advancing materials science globally.

Publications

  1. Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
    • Authors: Yao, Y.; Gusak, A.M.; Chen, C.; Liu, Y.; Tu, K.N.
    • Journal: Scripta Materialia
    • Year: 2024
    • Citations: 0
  2. Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps
    • Authors: Mao, X.; An, Y.; Chen, Y.; Tu, K.-N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2024
    • Citations: 0
  3. Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders
    • Authors: Qiao, J.; Mao, X.; Tu, K.-N.; Liu, Y.
    • Conference: 2024 International Conference on Electronics Packaging, ICEP 2024
    • Year: 2024
    • Citations: 0
  4. Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
    • Authors: Yao, Y.; An, Y.; Tu, K.N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2024
    • Citations: 0
  5. Elements of Electromigration: Electromigration in 3D IC Technology
    • Authors: Tu, K.-N.; Liu, Y.
    • Book: Elements of Electromigration: Electromigration in 3D IC Technology
    • Year: 2024
    • Citations: 0
  6. Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints
    • Authors: Hsu, W.-Y.; Yang, S.-C.; Lin, Y.-Y.; Chiang, C.-Y.; Chen, C.
    • Journal: Nanomaterials
    • Year: 2023
    • Citations: 1
  7. Electromigration in three-dimensional integrated circuits
    • Authors: Shen, Z.; Jing, S.; Heng, Y.; Tu, K.N.; Liu, Y.
    • Journal: Applied Physics Reviews
    • Year: 2023
    • Citations: 12
  8. To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
    • Authors: Huang, Y.-R.; Tran, D.-P.; Hsu, P.-N.; Tu, K.N.; Chen, C.
    • Journal: Journal of Materials Research and Technology
    • Year: 2023
    • Citations: 6
  9. Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
    • Authors: Yang, M.; Zhao, X.; Huo, Y.; Tu, K.-N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2023
    • Citations: 2
  10. Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder
    • Authors: Shen, Z.; An, Y.; Xiong, Z.; Tu, K.-N.; Liu, Y.
    • Conference: 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
    • Year: 2023
    • Citations: 0