King-Ning TU | Advanced Materials Engineering | Excellence in Research

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Prof Dr. King-Ning TU | Advanced Materials Engineering | Excellence in Research

Chair Professor at City University of Hong Kong, Hong Kong.

Prof. Dr. King-Ning Tu is a distinguished academic and researcher in materials science and engineering. He completed his education with a B.Sc. in Mechanical Engineering from National Taiwan University, an M.Sc. in Materials Science from Brown University, and a Ph.D. in Applied Physics from Harvard University. Throughout his illustrious career, Dr. Tu has held notable positions such as Professor and Chair of the Department of Materials Science and Engineering at UCLA, TSMC Chair Professor at National Chiao Tung University, and Chair Professor at City University of Hong Kong. His research focuses on electronic thin films, solder joint technology, and nanoscale materials, with significant contributions to these fields. Dr. Tu is recognized as a Fellow of prestigious societies like the American Physical Society and the Materials Research Society. He has authored several influential textbooks and received numerous awards for his outstanding contributions to materials science and engineering.

Professional Profiles:

Education

Prof. Dr. King-Ning Tu obtained his foundational education in Mechanical Engineering with a B.Sc. degree from National Taiwan University in Taiwan, which he completed in 1960. He then pursued further studies in the United States, earning an M.Sc. in Materials Science from Brown University in Providence, RI, in 1964. Continuing his academic journey, he completed his Ph.D. in Applied Physics at Harvard University in Cambridge, MA, in 1968. These educational milestones equipped him with a comprehensive understanding of mechanical engineering, materials science, and applied physics, forming the bedrock of his illustrious career in research and academia.

Professional Experience

Prof. Dr. King-Ning Tu has had a distinguished career spanning several prestigious institutions and roles in the field of materials science and engineering. He began as a Research Staff Member at IBM T. J. Watson Research Center, where he later became the 3rd Level Manager of the Materials Science Department. Over the years, he held significant academic positions, including Adjunct Professor at Cornell University and Professor and Chair at UCLA’s Department of Materials Science and Engineering. His contributions extended internationally, serving as the TSMC Chair Professor at National Chiao Tung University in Taiwan and as a Chair Professor at City University of Hong Kong. Tu’s research interests have focused on metal-silicon reactions, nanowires, and electronic packaging technology. He has authored several influential textbooks and received numerous honors, including fellowship in prestigious societies and awards for his research contributions to materials science and engineering.

Research Interest

Prof. Dr. King-Ning Tu is a distinguished figure in the field of materials science and engineering, celebrated for his extensive contributions spanning several decades. He began his illustrious career as a research staff member at IBM T. J. Watson Research Center, where he later rose to the position of 3rd Level Manager of the Materials Science Department. His tenure at IBM was marked by pioneering research in areas such as metal-silicon reactions, solder joint technology, and electromigration in nanowires. Over the years, Prof. Tu held significant academic appointments, including as Professor and Chair of the Department of Materials Science and Engineering at UCLA, and as a Distinguished Professor of Electrical Engineering. He also served as the TSMC Chair Professor at National Chiao Tung University and as a Chair Professor at City University of Hong Kong. Throughout his career, he has authored numerous influential textbooks and research papers that have advanced our understanding of electronic materials and their reliability in various applications. Prof. Tu’s work continues to inspire and guide researchers in the field worldwide.

Award and Honors

Prof. Dr. King-Ning Tu has garnered a wealth of accolades throughout his illustrious career in materials science and engineering. His contributions have been widely recognized by prestigious institutions and organizations worldwide. He was elected as a Fellow of the American Physical Society in 1981 and The Metallurgical Society in 1988. Serving as President of the Materials Research Society in 1981 and later being named a Fellow in 2010 further exemplifies his leadership in the field. Prof. Tu was honored with the Humboldt Research Award for Senior US Scientists in 1996 and appointed as a Royal Society/Kan Tong Po Visiting Professor at City University of Hong Kong in 2002. His election as an Academician of Academia Sinica, Taiwan, in 2002, and receipt of the TMS Electronic, Magnetic, and Photonic Materials Division Distinguished Scientist Award in 2007 highlight his profound impact on the discipline. More recently, he received the IEEE Components, Packaging, and Manufacturing Technology Award in 2017, underscoring his ongoing influence and contributions to the field.

Research Skills

Prof. Dr. King-Ning Tu is renowned for his extensive research contributions in materials science and engineering, spanning over several decades. His career began as a research staff member at IBM T. J. Watson Research Center, where he later served as the 3rd Level Manager of the Materials Science Department. Throughout his academic journey, Prof. Tu held significant positions including Adjunct Professor at Cornell University, Professor and Chair at UCLA’s Department of Materials Science and Engineering, and Distinguished Professor at UCLA’s Department of Electrical Engineering. His international engagements include roles as the TSMC Chair Professor at National Chiao Tung University in Taiwan, E-Sun scholar, and Chair Professor at City University of Hong Kong. Prof. Tu’s research focuses on diverse areas such as metal-silicon reactions, solder joint technology, and nanoscale materials’ kinetics and reliability. His leadership, mentorship, and prolific publication record have profoundly influenced the field, making him a pivotal figure in advancing materials science globally.

Publications

  1. Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
    • Authors: Yao, Y.; Gusak, A.M.; Chen, C.; Liu, Y.; Tu, K.N.
    • Journal: Scripta Materialia
    • Year: 2024
    • Citations: 0
  2. Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps
    • Authors: Mao, X.; An, Y.; Chen, Y.; Tu, K.-N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2024
    • Citations: 0
  3. Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders
    • Authors: Qiao, J.; Mao, X.; Tu, K.-N.; Liu, Y.
    • Conference: 2024 International Conference on Electronics Packaging, ICEP 2024
    • Year: 2024
    • Citations: 0
  4. Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
    • Authors: Yao, Y.; An, Y.; Tu, K.N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2024
    • Citations: 0
  5. Elements of Electromigration: Electromigration in 3D IC Technology
    • Authors: Tu, K.-N.; Liu, Y.
    • Book: Elements of Electromigration: Electromigration in 3D IC Technology
    • Year: 2024
    • Citations: 0
  6. Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints
    • Authors: Hsu, W.-Y.; Yang, S.-C.; Lin, Y.-Y.; Chiang, C.-Y.; Chen, C.
    • Journal: Nanomaterials
    • Year: 2023
    • Citations: 1
  7. Electromigration in three-dimensional integrated circuits
    • Authors: Shen, Z.; Jing, S.; Heng, Y.; Tu, K.N.; Liu, Y.
    • Journal: Applied Physics Reviews
    • Year: 2023
    • Citations: 12
  8. To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
    • Authors: Huang, Y.-R.; Tran, D.-P.; Hsu, P.-N.; Tu, K.N.; Chen, C.
    • Journal: Journal of Materials Research and Technology
    • Year: 2023
    • Citations: 6
  9. Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
    • Authors: Yang, M.; Zhao, X.; Huo, Y.; Tu, K.-N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2023
    • Citations: 2
  10. Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder
    • Authors: Shen, Z.; An, Y.; Xiong, Z.; Tu, K.-N.; Liu, Y.
    • Conference: 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
    • Year: 2023
    • Citations: 0

 

Md. Monirul Islam | Computer Science and Engineering | Best Researcher Award

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Assist Prof Dr. Md. Monirul Islam | Computer Science and Engineering | Best Researcher Award

Assistant Professor of Daffodil International University, Bangladesh.

Md. Monirul Islam is an accomplished academic professional with a robust background in computer science and engineering. Holding a Master’s degree from Dhaka University of Engineering & Technology and a Bachelor’s degree from Pabna University of Science and Technology, he brings a wealth of knowledge and expertise to his role. Currently serving as an Assistant Professor at Daffodil International University, he previously held positions at various renowned institutions in Bangladesh. Beyond teaching, Md. Monirul is actively involved in research, with interests spanning machine learning, IoT, deep learning, and data science. He has a notable publication record in esteemed journals and has presented his work at numerous international conferences. Md. Monirul’s dedication to academia, coupled with his strong research skills, positions him as a valuable contributor to the field of computer science.

Professional Profiles:

Education

Md. Monirul Islam pursued his academic journey with dedication and achieved notable qualifications in the field of computer science and engineering. He completed his Master of Computer Science from Dhaka University of Engineering & Technology, Gazipur, Bangladesh, in 2021, demonstrating exceptional academic performance with a result of 3.42/4.00. Prior to his master’s degree, Md. Monirul Islam obtained his Bachelor’s degree in Computer Science and Engineering from Pabna University of Science and Technology, Bangladesh, in 2017. During this period, he maintained a remarkable academic record with a result of 3.46/4.00. These educational accomplishments serve as a testament to Md. Monirul Islam’s commitment to academic excellence and his passion for advancing his knowledge and skills in computer science and engineering.

Professional Experience

Md. Monirul Islam, an Assistant Professor at Daffodil International University, Bangladesh, possesses a rich academic background and a dedication to shaping future software engineers. With a Master’s in Computer Science from Dhaka University of Engineering & Technology and a Bachelor’s in Computer Science and Engineering from Pabna University of Science and Technology, Md. Monirul has a solid foundation in his field. His teaching experience includes roles at various Bangladeshi universities, including adjunct faculty positions and senior lecturer roles. Beyond teaching, Md. Monirul is actively involved in research, with publications in reputable journals and conferences. His leadership roles, including heading the Rising Research Lab at the University of Information Technology and Sciences, underscore his commitment to academic excellence and advancement.

Research Interest

Md. Monirul Islam’s research interests span various aspects of computer science, with a particular focus on cutting-edge technologies. He is keenly interested in Internet of Things (IoT) applications, machine learning, data science, and deep learning. His research explores the intersection of these fields, aiming to develop innovative solutions for real-world problems. Additionally, Md. Monirul is passionate about computer vision, natural language processing, and artificial intelligence, seeking to advance the capabilities of these technologies for practical applications. His diverse research portfolio reflects his commitment to exploring emerging trends and pushing the boundaries of knowledge in the field of computer science.

Award and Honors

Md. Monirul Islam has received several prestigious awards and honors in recognition of his academic achievements and contributions to research. He was awarded the Research & Publication Award in 2022 by Uttara University, Bangladesh, highlighting his excellence in scholarly work. Additionally, he received the M.Sc. Thesis Paper Scholarship from Woosong University, South Korea, in 2021, showcasing his outstanding research contributions at an international level. Moreover, Md. Monirul has been recognized with Merit Scholarships from the Bangladesh Government and the United Group based on his exceptional academic performance during his educational journey. These accolades underscore his dedication to academic excellence and his significant contributions to the field of computer science.

Research Skills

Md. Monirul Islam possesses a diverse set of research skills that enable him to excel in his academic pursuits. Proficient in Endnote, LaTeX, MATLAB, and Python, he demonstrates a strong command of various research tools essential for data analysis and scientific inquiry. His expertise extends to deep learning, machine learning, data science, and IoT (Internet of Things), allowing him to conduct advanced research in these domains. With a keen eye for detail and a systematic approach, Md. Monirul employs these skills to tackle complex research challenges and produce high-quality outcomes. His proficiency in research methodologies and analytical techniques empowers him to make meaningful contributions to his field and advance knowledge in computer science and related disciplines.

Publications

  1. Title: Development of Computer-Based Experiment Set on Simple Harmonic Motion of Mass on Springs
    • Author: P. Musik
    • Journal: Turkish Online Journal of Educational Technology-TOJET
    • Volume: 16
    • Issue: 4
    • Pages: 1-11
    • Year: 2017
    • Citations: 13
  2. Title: Real-Time Graphing of Simple Harmonic Motion of Mass on Springs with an Arduino Based on an Experiment Set for Teaching and Learning Physics
    • Authors: W. Sukmak, P. Musik
    • Journal: Turkish Online Journal of Educational Technology-TOJET
    • Volume: 21
    • Issue: 1
    • Pages: 114-123
    • Year: 2022
    • Citations: 5
  3. Title: Development of an automated water management system in orchards in southern Thailand
    • Author: P. Musik
    • Journal: International Journal on Smart Sensing and Intelligent Systems
    • Volume: 13
    • Issue: 1
    • Pages: 1-7
    • Year: 2020
    • Citations: 3
  4. Title: Two-dimensional lattice Boltzmann method for cavity flow simulation
    • Authors: P. MUSIK, K. JAROENSUTASINEE
    • Journal: Walailak Journal of Science and Technology (WJST)
    • Volume: 1
    • Issue: 1
    • Pages: 53-70
    • Year: 2004
    • Citations: 3
  5. Title: Development of a computer-based simple pendulum experiment set for teaching and learning physics
    • Authors: W. Sukmak, P. Musik
    • Journal: International Journal on Smart Sensing and Intelligent Systems
    • Volume: 14
    • Issue: 1
    • Pages: 1-8
    • Year: 2021
    • Citations: 2
  6. Title: Development of computer-based experimental set in physics for free-falling object
    • Author: P. Musik
    • Conference: The European Conference on Education 2014
    • Pages: 309-322
    • Year: 2014
    • Citations: 1
  7. Title: Large-scale simulation using parallel computing toolkit and server message block
    • Authors: P. Musik, K. Jaroensutasinee
    • Journal: WSEAS TRANSACTIONS ON MATHEMATICS
    • Volume: 6
    • Issue: 2
    • Pages: 369
    • Year: 2007
    • Citations: 1
  8. Title: A prototype pond water management system (dissolved oxygen, pH and temperature) for giant freshwater prawn farming in Pak Phanang, Southern Thailand
    • Authors: P. Songpayome, S. Sutin, W. Sukmak, U. Wanthong, N. Limchoowong, P. Musik
    • Journal: Heliyon
    • Year: 2024
  9. Title: Analysis of Areas at Risk of Fire in Khuan Kreng Peat Swamp Forest in South Thailand
    • Authors: U. Wanthong, P. Musik, S. Ruang-on, M. Pollar, R. Phetkhong, P. Sricharoen
    • Journal: International Journal of Science and Innovative Technology
    • Volume: 6
    • Issue: 2
    • Pages: 38-52
    • Year: 2023
  10. Title: Model Development in Direction of Water Flow on the Surface DEM for Flood Forecasting and Early Warning of Nakhon Si Thammarat Province
    • Authors: E. Petthongduang, V. Jaroenpuntaruk, P. Musik
    • Journal: Wichcha Journal Nakhon Si Thammarat Rajabhat University
    • Volume: 37
    • Issue: 2
    • Pages: 13-23
    • Year: 2018