Liangliang Zhang | Advanced Materials Engineering | Best Researcher Award

Prof. Liangliang Zhang | Advanced Materials Engineering | Best Researcher Award

Associate Professor at China Agricultural University, China.

Liangliang Zhang is an accomplished Associate Professor at China Agricultural University, recognized for his pioneering research in advanced engineering materials and structures. With expertise in experimental, analytical, and numerical methods, Zhang’s interdisciplinary approach addresses critical challenges in materials science, focusing on multiphase composites, quasicrystal materials, and computational algorithms. He holds editorial roles and collaborates extensively with global institutions, contributing to numerous publications in esteemed journals. Zhang’s work underscores his commitment to advancing resilient and sustainable engineering solutions, making a profound impact on the field.

Professional Profiles:

Education 🎓

Liangliang Zhang holds a Ph.D. in Engineering from China Agricultural University, Beijing, China, with expertise in the multi-scale and multi-physics characterization of advanced engineering materials and structures. His academic journey also includes [mention other degrees if applicable]. This educational foundation has equipped him with comprehensive knowledge and skills essential for his interdisciplinary research pursuits, spanning structures and materials, innovative construction technologies, and advanced test methods.

Professional Experience

Liangliang Zhang is an accomplished Associate Professor at China Agricultural University, Beijing, China, where he has been instrumental in advancing research and education in the field of engineering materials and structures. He has extensive experience in conducting research across multiple scales and physics, focusing on the characterization of materials through experimental, analytical, and numerical methods. His professional journey includes [mention any notable positions or roles, such as previous academic appointments or leadership roles in research]. Zhang has also been actively involved in consultancy projects and has collaborated with prestigious institutions worldwide, further enriching his expertise and contributing significantly to the field of engineering science.

Research Interest

Certainly! Liangliang Zhang’s research interests encompass a broad spectrum of topics within the realm of engineering materials and structures. His primary interests lie in the multi-scale and multi-physics characterization of advanced materials, focusing on innovative construction technologies, and developing robust testing methodologies. Zhang is particularly passionate about exploring the characteristics of multiphase and multifield particle composites, investigating the behavior of defects in quasicrystal materials and structures, and advancing cross-scale computational algorithms. Additionally, his research extends to energy harvesting materials and systems, aiming to enhance sustainability and resilience in engineering applications.

Research Innovations

Liangliang Zhang has contributed significantly to the field of advanced engineering materials and structures through a series of impactful innovations and research advancements. His work primarily focuses on the multi-scale and multi-physics characterization of materials, employing experimental, analytical, and numerical methods. Zhang’s notable contributions include pioneering studies on multiphase and multifield particle composites, which have advanced understanding in material science and engineering. His investigations into the behavior of defects in quasicrystal materials and structures have led to insights crucial for improving material durability and performance. Moreover, Zhang has developed innovative cross-scale computational algorithms and explored energy harvesting materials and systems, contributing to more efficient and sustainable engineering solutions.

Research Skills

Liangliang Zhang, an Associate Professor at China Agricultural University, excels in advancing the field of advanced engineering materials and structures through a diverse set of research skills. His expertise spans experimental techniques, analytical methods, and numerical modeling, crucial for characterizing materials across various scales. Zhang’s interdisciplinary approach integrates insights from multiple fields to tackle complex challenges, focusing on multiphase and multifield particle composites, quasicrystal materials, and innovative computational algorithms. His collaborative efforts with global institutions underscore his capability to drive impactful research and innovation. With a robust publication record in prestigious journals and editorial roles in prominent scientific platforms like Energies, Zhang continues to contribute significantly to the advancement of material science and engineering solutions worldwide.

Publications

  1. Analysis of multilayered two-dimensional decagonal piezoelectric quasicrystal beams with mixed boundary conditions
    • Authors: Wang, Y.; Liu, C.; Zhu, Z.; Zhang, L.; Gao, Y.
    • Year: 2024
  2. Three-Dimensional General Solutions of Orthorhombic Quasicrystals With Constraints
    • Authors: Zhang, J.; Zhang, L.; Xiang, M.; Gao, Y.; Pan, E.
    • Year: 2024
  3. Thermomechanical modeling of functionally graded materials based on bimaterial fundamental solutions
    • Authors: Wu, C.; Zhang, L.; Weng, G.J.; Yin, H.
    • Year: 2024
  4. Mechanical Analysis of Functionally Graded Multilayered Two-Dimensional Decagonal Piezoelectric Quasicrystal Laminates with Imperfect Interfaces
    • Authors: Wang, Y.; Liu, C.; Zhang, L.; Pan, E.; Gao, Y.
    • Year: 2024
  5. Electromechanical coupling characteristics of multilayered piezoelectric quasicrystal plates in an elastic medium
    • Authors: Feng, X.; Zhang, L.; Li, Y.; Gao, Y.
    • Year: 2024
  6. Estimation of heat transfer and thermal conductivity of particle-reinforced hollow cylinder composites
    • Authors: Zhang, G.; Zhang, L.; Lei, G.; Gao, Y.
    • Year: 2024
  7. Vibration analysis of quasicrystal sector plates with porosity distribution in a thermal environment
    • Authors: Feng, X.; Zhang, L.; Li, Y.; Gao, Y.
    • Year: 2024
  8. Static solution of two-dimensional decagonal piezoelectric quasicrystal laminates with mixed boundary conditions
    • Authors: Liu, C.; Feng, X.; Li, Y.; Zhang, L.; Gao, Y.
    • Year: 2024
    • Citations: 3
  9. Thermoelastic analysis of a bi-layered system with the single domain inclusion-based boundary element method
    • Authors: Wu, C.; Zhang, L.; Singhatanadgid, P.; Zhang, D.
    • Year: 2023
    • Citations: 2
  10. Image force in cubic piezoelectric quasicrystal half-space and bi-material composite space
    • Authors: Mu, X.; Xu, W.; Zhu, Z.; Zhang, L.; Gao, Y.
    • Year: 2023

 

 

King-Ning TU | Advanced Materials Engineering | Excellence in Research

Prof Dr. King-Ning TU | Advanced Materials Engineering | Excellence in Research

Chair Professor at City University of Hong Kong, Hong Kong.

Prof. Dr. King-Ning Tu is a distinguished academic and researcher in materials science and engineering. He completed his education with a B.Sc. in Mechanical Engineering from National Taiwan University, an M.Sc. in Materials Science from Brown University, and a Ph.D. in Applied Physics from Harvard University. Throughout his illustrious career, Dr. Tu has held notable positions such as Professor and Chair of the Department of Materials Science and Engineering at UCLA, TSMC Chair Professor at National Chiao Tung University, and Chair Professor at City University of Hong Kong. His research focuses on electronic thin films, solder joint technology, and nanoscale materials, with significant contributions to these fields. Dr. Tu is recognized as a Fellow of prestigious societies like the American Physical Society and the Materials Research Society. He has authored several influential textbooks and received numerous awards for his outstanding contributions to materials science and engineering.

Professional Profiles:

Education

Prof. Dr. King-Ning Tu obtained his foundational education in Mechanical Engineering with a B.Sc. degree from National Taiwan University in Taiwan, which he completed in 1960. He then pursued further studies in the United States, earning an M.Sc. in Materials Science from Brown University in Providence, RI, in 1964. Continuing his academic journey, he completed his Ph.D. in Applied Physics at Harvard University in Cambridge, MA, in 1968. These educational milestones equipped him with a comprehensive understanding of mechanical engineering, materials science, and applied physics, forming the bedrock of his illustrious career in research and academia.

Professional Experience

Prof. Dr. King-Ning Tu has had a distinguished career spanning several prestigious institutions and roles in the field of materials science and engineering. He began as a Research Staff Member at IBM T. J. Watson Research Center, where he later became the 3rd Level Manager of the Materials Science Department. Over the years, he held significant academic positions, including Adjunct Professor at Cornell University and Professor and Chair at UCLA’s Department of Materials Science and Engineering. His contributions extended internationally, serving as the TSMC Chair Professor at National Chiao Tung University in Taiwan and as a Chair Professor at City University of Hong Kong. Tu’s research interests have focused on metal-silicon reactions, nanowires, and electronic packaging technology. He has authored several influential textbooks and received numerous honors, including fellowship in prestigious societies and awards for his research contributions to materials science and engineering.

Research Interest

Prof. Dr. King-Ning Tu is a distinguished figure in the field of materials science and engineering, celebrated for his extensive contributions spanning several decades. He began his illustrious career as a research staff member at IBM T. J. Watson Research Center, where he later rose to the position of 3rd Level Manager of the Materials Science Department. His tenure at IBM was marked by pioneering research in areas such as metal-silicon reactions, solder joint technology, and electromigration in nanowires. Over the years, Prof. Tu held significant academic appointments, including as Professor and Chair of the Department of Materials Science and Engineering at UCLA, and as a Distinguished Professor of Electrical Engineering. He also served as the TSMC Chair Professor at National Chiao Tung University and as a Chair Professor at City University of Hong Kong. Throughout his career, he has authored numerous influential textbooks and research papers that have advanced our understanding of electronic materials and their reliability in various applications. Prof. Tu’s work continues to inspire and guide researchers in the field worldwide.

Award and Honors

Prof. Dr. King-Ning Tu has garnered a wealth of accolades throughout his illustrious career in materials science and engineering. His contributions have been widely recognized by prestigious institutions and organizations worldwide. He was elected as a Fellow of the American Physical Society in 1981 and The Metallurgical Society in 1988. Serving as President of the Materials Research Society in 1981 and later being named a Fellow in 2010 further exemplifies his leadership in the field. Prof. Tu was honored with the Humboldt Research Award for Senior US Scientists in 1996 and appointed as a Royal Society/Kan Tong Po Visiting Professor at City University of Hong Kong in 2002. His election as an Academician of Academia Sinica, Taiwan, in 2002, and receipt of the TMS Electronic, Magnetic, and Photonic Materials Division Distinguished Scientist Award in 2007 highlight his profound impact on the discipline. More recently, he received the IEEE Components, Packaging, and Manufacturing Technology Award in 2017, underscoring his ongoing influence and contributions to the field.

Research Skills

Prof. Dr. King-Ning Tu is renowned for his extensive research contributions in materials science and engineering, spanning over several decades. His career began as a research staff member at IBM T. J. Watson Research Center, where he later served as the 3rd Level Manager of the Materials Science Department. Throughout his academic journey, Prof. Tu held significant positions including Adjunct Professor at Cornell University, Professor and Chair at UCLA’s Department of Materials Science and Engineering, and Distinguished Professor at UCLA’s Department of Electrical Engineering. His international engagements include roles as the TSMC Chair Professor at National Chiao Tung University in Taiwan, E-Sun scholar, and Chair Professor at City University of Hong Kong. Prof. Tu’s research focuses on diverse areas such as metal-silicon reactions, solder joint technology, and nanoscale materials’ kinetics and reliability. His leadership, mentorship, and prolific publication record have profoundly influenced the field, making him a pivotal figure in advancing materials science globally.

Publications

  1. Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
    • Authors: Yao, Y.; Gusak, A.M.; Chen, C.; Liu, Y.; Tu, K.N.
    • Journal: Scripta Materialia
    • Year: 2024
    • Citations: 0
  2. Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps
    • Authors: Mao, X.; An, Y.; Chen, Y.; Tu, K.-N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2024
    • Citations: 0
  3. Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders
    • Authors: Qiao, J.; Mao, X.; Tu, K.-N.; Liu, Y.
    • Conference: 2024 International Conference on Electronics Packaging, ICEP 2024
    • Year: 2024
    • Citations: 0
  4. Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology
    • Authors: Yao, Y.; An, Y.; Tu, K.N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2024
    • Citations: 0
  5. Elements of Electromigration: Electromigration in 3D IC Technology
    • Authors: Tu, K.-N.; Liu, Y.
    • Book: Elements of Electromigration: Electromigration in 3D IC Technology
    • Year: 2024
    • Citations: 0
  6. Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints
    • Authors: Hsu, W.-Y.; Yang, S.-C.; Lin, Y.-Y.; Chiang, C.-Y.; Chen, C.
    • Journal: Nanomaterials
    • Year: 2023
    • Citations: 1
  7. Electromigration in three-dimensional integrated circuits
    • Authors: Shen, Z.; Jing, S.; Heng, Y.; Tu, K.N.; Liu, Y.
    • Journal: Applied Physics Reviews
    • Year: 2023
    • Citations: 12
  8. To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
    • Authors: Huang, Y.-R.; Tran, D.-P.; Hsu, P.-N.; Tu, K.N.; Chen, C.
    • Journal: Journal of Materials Research and Technology
    • Year: 2023
    • Citations: 6
  9. Comparison between bulk and particle solder alloy on the performance of low-melting solder joints
    • Authors: Yang, M.; Zhao, X.; Huo, Y.; Tu, K.-N.; Liu, Y.
    • Journal: Journal of Materials Research and Technology
    • Year: 2023
    • Citations: 2
  10. Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder
    • Authors: Shen, Z.; An, Y.; Xiong, Z.; Tu, K.-N.; Liu, Y.
    • Conference: 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
    • Year: 2023
    • Citations: 0